Chip Scale Package: Design, Materials, Process, Reliability, by John H. Lau

By John H. Lau

The 1st entire, in-depth consultant to chip scale packaging, this reference promises state of the art info at the most vital new improvement in digital packaging for the reason that floor mount expertise (SMT). that includes the most recent layout innovations, plus info on greater than forty sorts of CSP, Chip Scale package deal palms engineers and architects the entire, expert set of operating instruments that they should resolve technical and layout matters; locate the most productive, low in cost CSP suggestions for his or her deployments; solution questions about interfacing, velocity, robustness, and extra; evaluate homes of wirebonds, turn chips, inflexible and flex substrates, wafer-level redistribution, and different CSP items; get the most recent info on new choices from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, nationwide Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and different significant businesses; and know about CSP items below improvement. A revolution in electronics, CSP is taking the electronics through typhoon. web page after web page, this standard-setting consultant provides either crucial technical information and an eye-opening assessment of this fast-developing box. irrespective of the way you use Chip Scale package deal, youOll see why itOs the source of selection should you are looking to be on the most sensible of the sport.

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Extra resources for Chip Scale Package: Design, Materials, Process, Reliability, and Applications

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36M-1996; Surface Texture Symbols. 1-1995; Surface Texture (Surface Roughness, Waviness, and Lay). ISO 1302:1994; Technical Drawings — Method of indicating surface texture. ISO 4288:1996; Geometrical Product Specifications (GPS) — Surface texture: Profile method — Rules and procedures for the assessment of surface texture. ISO 12085:1996; Geometrical Product Specifications (GPS) — Surface texture: Profile method — Motif parameters. ISO 3274:1996; Geometrical Product Specifications (GPS) — Surface texture: Profile method — Nominal characteristics of contact stylus instruments.

W. T. Macher, Mitigating the Tradeoff between Time-to-Market and Manufacturing Performance: Knowledge Management in Developing New Technologies, mimeo, Brigham Young University, 2003. 31. M. Quirk, J. Serda, Semiconductor Manufacturing Technology, Prentice Hall, New York, 2001. 32. T. Bibby and K. H. O. , Academic Press, 2000, chap. 2. 33. D. M. Boyd, Y. Gotkis, and R. Kistler, Edge Control for Removal Uniformity by Air Bearing Technology on a Linear CMP System, SEMICON Taiwan 2001, Taipei, September 17–19, 2001.

Dishing, as its name implies, is a localized defect in which each connecting side is overpolished. 9a. Erosion is also a localized defect. 9b. Both dishing and erosion are physical defects that can be seen through the microscope. Recess and field loss are overpolished sites, but they are more of an electronic property loss. Scratches and pits are mainly due to mechanical abrasion and chemical attack, leading to localized physical damage. 9d. 2 nm Applications to Tribology Depth direction profile of each element at friction surface (+ ion gun) Lattice defects and compression analysis (+ PMA) Elemental analysis, electron state analysis (+TEM) Stress due to slip, film thickness changes, etc.

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