Dielectric films for advanced microelectronics by Mikhail Baklanov, Karen Maex, Martin Green

By Mikhail Baklanov, Karen Maex, Martin Green

The subject of skinny motion pictures is a space of increasing importance in fabrics technological know-how, electric engineering and utilized good kingdom physics; with either study and business purposes in microelectronics, machine production, and actual units. complicated, high-performance desktops, high-definition television, broadband imaging platforms, flat-panel screens, robot structures, and clinical electronics and diagnostics are a couple of examples of the miniaturized machine applied sciences that depend upon the usage of skinny movie fabrics.

This e-book provides an in-depth assessment of the radical advancements made by way of the medical leaders within the region of contemporary dielectric motion pictures for complicated microelectronic purposes. It contains transparent, concise factors of fabric technology of dielectric motion pictures and their challenge for equipment operation, together with high-k, low-k, medium-k dielectric movies and likewise particular good points and specifications for dielectric motion pictures utilized in the packaging expertise. A vast variety of similar subject matters are lined, from actual ideas to layout, fabrication, characterization, and functions of novel dielectric motion pictures.

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Proc. ULSI, XVII, 253 (2002), (MRS, Warrendale, PA). M. E. R. Begley, Int. J. Solids and Structures, 39, 1443 (2002). [59] S. , 2002 IEDM Technical Digest, 61 (2002) (IEEE Catalog nr. 02CH37358, Piscataway, NJ). [60] M. , Conf. Proc. ULSI, VXIII, 493 (2003) MRS, Warrendale, PA. A. , Conf. Proc. ULSI, VXI, 595 (2001) MRS, Warrendale, PA. [62] P. Wrshka, G. -S. Low, K. Dev, D. Dobuzinsky, R. Conti, and P. Schafer, Conf. Proc. ULSI, VXI, 549 (2001) MRS, Warrendale, PA. [63] D. , Proceedings of the IEEE 2004 Intern.

5 GPa and E < 5 GPa for most polymeric dielectrics [37]. The mechanical and chemical properties of DLC enabled efficient removal of the metallization and good planarization of the damascene structures by CMP [34]. ) FDLC The integration of the FDLC films in a BEOL interconnect structure requires good adhesion of FDLC to other dielectrics, such as silicon oxide, silicon nitride, and to metals, such as Ta. FDLC films, 700 nm thick, have been deposited on SiN, SiO2, or Ta films, deposited on Si substrates.

Dukovic, R. Wachnik, P. McLaughlin, T. Katsetos, H. Rathore, R. Schulz, L. Su, S. Luce, N. Rohrer, and J. Slattery, Tech. Dig. IEEE IEDM, 376 (1997). LOW AND ULTRALOW DIELECTRIC CONSTANT FILMS PREPARED 31 [2] S. Venkatesan et al. Tech. Dig. IEEE IEDM, 769 (1997). [3] International Technology Roadmap for Semiconductors, 2003 Edition, International SEMATECH, 2706 Montopolis Drive Austin, TX 78741, USA. [4] The National Technology Roadmap for Semiconductors, San Jose, SIA, 1997. [5] C. , 26, January (2005).

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