By John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee
* An engineer's guidebook demonstrating non-toxic electronics production processes
* Covers manufacture of published circuits, built-in circuits, revealed circuit forums assemblies, digital applications, and extra
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Additional info for Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive
Example text
7. Reflow the micro-solder balls in a nitrogen atmosphere furnace, and the flux residue is removed by cleaning. 5Ag microsolder balls. They are made from a bulk of Sn-Ag solid by cutting it into many units of specified mass that are heated and melted at a temperature that is much higher than the material’s melting point. Due to the surface tension of liquid metal of the solder, the balls can achieve a high level of sphericity. 9 shows the diameter (size) and diameter (x and y directions) measurements of 50 of the Sn-Ag microsolder balls.
5), but it is applied to ordinary flip chip packages (Fig. 6) as well. The manufacturing processes of the wafer-level redistribution flip chip package are (1) deposit the first layer of dielectric [benzocyclobutene (BCB1)] on the wafer; (2) open windows to expose the die bond pads; (3) sputter the wafer with layers of Al, NiV, and Cu for UBM; and (4) pattern the UBM to form traces and bond pads for solder bumps. , high throughput, uniform bump height, and flexible solder alloy selection). The drawbacks are the tooling that is required and the availability of microball mounters.
Messler, “The Effect of Soldering Process Variables on the Microstructure and Mechanical Properties of Eutectic Sn-Ag/Cu Solder Joints,” Journal of Electronic Materials, 24(10):1465–1472, 1995. 74. Hwang, J. , Modern Solder Technology for Competitive Electronics Manufacturing, McGraw-Hill, New York, 1996. 75. , J. Rejent, I. Artaki, U. Ray, D. Finley, and A. Jackson, “Compatibility of LeadFree Solders with Lead Containing Surface Finishes as a Reliability Issue in Electronic Assemblies,” Proceedings of the IEEE Electronic Components and Technology Conference, pp.