Hybrid Microcircuit Technology Handbook by Licari, J.J.; Enlow, L.R.

By Licari, J.J.; Enlow, L.R.

The Hybrid Microcircuit know-how guide integrates the various various applied sciences utilized in the layout, fabrication, meeting, and trying out of hybrid segments the most important to the luck of manufacturing trustworthy circuits in excessive yields. between those are: resistor trimming, twine bonding, die attachment, cleansing, airtight sealing, and moisture research. as well as skinny motion pictures, thick movies, and meeting approaches, vital chapters on substrate decisions, dealing with (including electrostatic discharge), failure research, and documentation are incorporated. A accomplished bankruptcy of layout instructions can be of worth to fabrics and procedure engineers, chemists, and electric engineers who layout and try hybrid circuits.

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Substrateswith ground surfaces may cost five to seven times more than the as-fired types, but for dense, fine-line circuitry, high resistor density, or tight system-packaging considerations, ground and polished substrates may benecessary, at least on the surface side that is to be screen-printed. The approximate dimensional tolerances for as-fired substrates are given in Table 1. Dimensional tolerances for ground substrates are largely a function of cost. 0005inch are available. 001 inch per inch or even 0,0005 inches per inch, and nearly any surface finish are also available.

Moderate-density in TO package. 0 FUNCTIONS Substrates for hybrid circuits serve three key functions: 1. Mechanical support for the assembly of the devices 2. Base for the electrical interconnect pattern and batch fabricated film resistors 3. Medium for the dissipation of heat from devices Besides these basic mechanical, electrical, and thermal functions, substrates mustmeet many other electrical, thermal, physical, and chemical requirements, among which are: High electrical insulation resistance-to avoid electrical leakage currents between closely spaced conductor lines.

5% beryllia or aluminum nitride should be used. Substrates are available in either the as-$red condition or with ground and polished surfaces. Substrateswith ground surfaces may cost five to seven times more than the as-fired types, but for dense, fine-line circuitry, high resistor density, or tight system-packaging considerations, ground and polished substrates may benecessary, at least on the surface side that is to be screen-printed. The approximate dimensional tolerances for as-fired substrates are given in Table 1.

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